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Properly cooling network devices that require side-to-side airflow in an enclosure can present many challenges. Air recirculation that occurs in an enclosure can cause temperatures to rise significantly causing overheating of the devices.
Airflow Managers and Directors draw air into the enclosure, redirect the air to the side intake of the device and allow the removal of the hot air out of the enclosure. These solutions extend equipment life by providing proper inlet temperatures and eliminating harmful recirculation within the rack.
The Airflow Director is specifically designed for switches that have side-to-side cooling. The intake allows cold air to be drawn from the cold aisle, through the Airflow Director and to enter the switch from the side. The switch’s fans then pull the cool air across the device and exhaust the warm air out the opposite side.
Contact TAB TE for more information.